The design and development of all military electronic equipment shall provide fail-safe features for safety of personnel during the installation, operation, maintenance, and repair or interchanging of a complete equipment assembly or component parts thereof.
4.2 Bonding in hazardous areas.
Electronic equipment to be installed in areas where explosive or fire hazards exist shall be bonded in accordance with MIL-B-5087 for aerospace systems, MIL-STD-1310 for shipboard systems and NFPA 70, Chapter 5, for ground systems or as otherwise specified in the detail equipment specification.
Replaced/Superseded by document(s)
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|MIL STD- Standard General Requirements for Electronic Equipement (1992).PDF||application/pdf||5.7 MB||English||DOWNLOAD!|
1.1 Requirements applicable to electronic equipment.
This standard covers the common requirements to be used in military specifications for electronic equipment.
1.2 Revision of requirements.
Revisions of individual requirements are indicated by a date below the requirement number located at the bottom of the page. A note, *Supersedes Requirement (no.) (date)', is placed in the lower corner of each revised page, opposite the requirement number and date. When the basic document is revised, those requirements not affected by change retain their existing date.
Although individual requirements are reviewed and updated or validated at least once every twelve months, requirements are not redated unless technical changes are made.