MIL-HDBK-217F, Notice 2 provides the following changes based upon a recently completed study (see Ref. 37 listed in Appendix C):
• Revised resistor and capacitor models, including new models to address chip devices.
• Updated failure rate models for transformers, coils, motors, relays, switches, circuit breakers, connectors, printed circuit boards (with and without surface mount technology) and connections.
• A new model to address surface mounted technology solder connections.
• A revised Traveling Wave Tube model based upon data supplied by the Electronic Industries Association Microwave Tube Division. This further lowers the calculated failure rates beyond the earlier modifications made in the base document (MIL-HDBK-217F, 2 December 1991).
• Revised the Fast Recovery Power Rectifier base failure rate downward based on a reevaluation of Ref. 28.
Defines standard
Replaced/Superseded by document(s)
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| File | MIME type | Size (KB) | Language | Download | |
|---|---|---|---|---|---|
| Military Handbook- Reliability Predicition of Electronic Equipment.pdf | application/pdf | 5.91 MB | English | DOWNLOAD! |
Provides definitions
Cover images
Introduction
1.1 Purpose
This handbook Is for guidance only and shall not be cited as a requirement. If it is, the contractor does not have to comply (see Page 1-2). The purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military electronic equipment and systems. It provides a common basis for reliability predictions during acquisition programs for military electronic systems and equipment. It also establishes a common basis for comparing and evaluating reliability predictions of related or competitive designs. The handbook is intended to be used as a tool to increase the reliability of the equipment being designed.
1.2 Application
This handbook contains two methods of reliability prediction - “Part Stress Analysis” in Sections 5 through 23 and ‘Parts Count” in Appendix A. These methods vary in degree of information needed to apply them. The Part Stress Analysis Method requires a greater amount of detailed information and is applicable during the later design phase when actual hardware and circuits are being designed. The Parts Count Method requires less information, generally part quantities, quality level, and the application environment. This method is applicable during the early design phase and during proposal formulation. In general, the Parts Count Method will usually result in a more conservative estimate (i.e., higher failure rate) of system reliability than the Parts Stress Method.